Copper Bond Diamond Transitional Polishing Pads (RFP-C2)

Copper Bond Diamond Transitional Polishing Pads (RFP-C2)

1. Polishing Method: Dry / Wet Polishing of Concrete
2. Diameter: 3 Inches
3. Grit size(mesh): 50#, 100#, 200#, 400#, 800#, 1500#, 3000#
4. Diamond Height (Thickness): 10mm


Resin bonding grinding pads with Velcro backing for fine concrete polishing. 

Resin bonding strength is much weaker than ceramic bonding and hybrid bonding, but will yield the smoothest surface. 
Using resin grinding pads as the last steps of polishing to achieve a high degree of shine and reflectivity on your surface.

For concrete honing and polishing, hybrid bond and ceramic bond pads are recommended for 50, 100, 200 grits for their longer lifetime.